FEP 9495 X
Fluoroplastic Resin
For inventory control purposes, product name may be followed by an X. Products labeled FEP 9495 and FEP 9495 X are equivalent, and all information in this document is applicable to both.
Description
FEP 9495 is a melt-processible fluoroplastic resin available in pellet form. It is a copolymer of tetrafluoroethylene and hexafluoropropylene, without additives. With a relatively high melt flow rate and excellent electrical properties, FEP 9495 has been specifically designed for high-speed extrusion of thin coatings on small-gauge wires for twisted-pair constructions.
Typical Applications:
Applications for FEP 9495 include small diameter, thin wall wire and cable insulation; industrial film; and intricate or thin wall parts made by injection molding.
Processing
FEP 9495 can be processed by conventional melt extrusion, and by injection, compression, and transfer molding processes. High melt strength and heat stability permit the use of relatively large die openings and high temperature draw-down techniques that increase production rates. Reciprocating screw injection molding machines are preferred. Corrosionresistant metals should be used in contact with molten fluoroplastic resin. Extruder barrel should be long, relative to diameter, to provide residence time for heating the resin to approximately 400 °C (750 °F).
Storage and Handling
The properties of FEP 9495 resins are not affected by storage time. Ambient storage conditions should be designed to avoid airborne contamination and water condensation on the resin when opening and emptying the packaging.
We can give discount according to order quantity.
We also have good experience in transportation both by air and ocean to overseas.
Grade |
MFR (g/10 min) |
Melting Point °C (°F) ASTM,D4591/D3418 |
Features |
Applications |
General-Purpose |
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100 |
7 |
260 (500) |
General- purpose resin with medium melt flow rate |
|
106 |
100 |
255 (491) |
High productivity grade |
|
Improved Stress Crack Resistance |
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9302 |
255 |
260 (500) |
Good viscosity, highest degree of stress crack resistance |
|
CJ95 |
5 |
255 (491) |
Low MFR, higher degree of stress crack resistance |
|
CJ99 |
9 |
255 (491) |
High degree of stress crack resistance |
|
Superior Electrical Properties |
||||
9494 |
30 |
255 (491) |
Improved dissipation factor at high frequencies. Significant plateout resistance in melt extrusion |
|
9495 |
30 |
255 (491) |
High speed, premium resin with improved adhesion to copper wire |
|
9835 |
20 |
255 (491) |
Medium melt flow resin with improved adhesion to copper wire under specific wireline process conditions |
|
9898 |
30 |
255 (491) |
Best-in-class dissipation factor at high frequencies (>10 GHz). Significant plateout resistance in melt extrusion |
|
Specialty |
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9819FL |
30 |
255 (491) |
Specialty resin available as loosely compacted fluff |
|